IEC 62878-2-602:2021
$22.10
Device embedding assembly technology – Part 2-602: Guideline for stacked electronic module – Evaluation method of inter-module electrical connectivity
| Published By | Publication Date | Number of Pages |
| IEC | 2021-06-22 | 28 |
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
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