IEC 62899-202-7:2021

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Printed electronics – Part 202-7: Materials – Printed film – Measurement of peel strength for printed layer on flexible substrate by 90° peel method

Published By	Publication Date	Number of Pages
IEC	2021-03-03	16

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Categories: 29.035.01 - Insulating materials in general, 31.180 - Printed circuits and boards, IEC

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Description

IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.

Additional information

Published Code	IEC
Published By	International Electrotechnical Commission
Publication Date	2021-03-03
Pages Count	16
Language	English
Edition	1.0
File Size	1.0 MB
ICS Codes	29.035.01 - Insulating materials in general 31.180 - Printed circuits and boards

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IEC 62899-202-7:2021

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