IEC PAS 62647-23:2011
$63.70
Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
| Published By | Publication Date | Number of Pages |
| IEC | 2011-07-28 | 48 |
IEC/PAS 62647-23:2011(E) provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes.
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