IEC TS 62647-4:2018

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Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 4: Ball grid array (BGA) re-balling

Published By	Publication Date	Number of Pages
IEC	2018-04-10	46

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Categories: 03.100.50 - Production. Production management, 31.020 - Electronic components in general, 49.060 - Aerospace electric equipment and systems, IEC

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Description

IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.

Additional information

Published Code	IEC
Published By	International Electrotechnical Commission
Publication Date	2018-04-10
Pages Count	46
Language	English
Edition	1.0
File Size	1.2 MB
ICS Codes	03.100.50 - Production. Production management 31.020 - Electronic components in general 49.060 - Aerospace electric equipment and systems

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IEC TS 62647-4:2018

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