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IPC SMC-WP-003:1993

IPC SMC-WP-003:1993

$24.70

Chip Mounting Technology (CMT)

Published By Publication Date Number of Pages
IPC 1993-08 35
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Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed.

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IPC SMC-WP-003:1993
$24.70