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JIS C 60068-2-54:2009

JIS C 60068-2-54:2009

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Environmental testing – Part 2-54: Tests-Test Ta: Solderability testing of electronic components by the wetting balance method

Published By Publication Date Number of Pages
JIS 2009-07-20 23
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This Standard outlines the solder bath wetting balance method applicable for any shape of component terminations to determine the solderability.

It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods.

For surface mounting devices (SMD), IEC 60068-2-69 should be applied.

This Standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

NOTE: The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows:

IEC 60068-2-54: 2006 Environmental testing-Part 2-54: Tests-Test Ta: Solderability testing of electronic components by the wetting balance method (MOD)

The symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified) and NEQ (not equivalent) according to ISO/ IEC Guide 21.

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JIS C 60068-2-54:2009
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