This guideline is applicable to existing lead solder production products that will change to lead-free solder processes to meet the ELV Directive 2000/53/EC Annex II, exemption 8B requirements. This guideline is applicable to similar products used by multiple OEM's that have the same manufacturing processes / equipment. The intent is to streamline the supplier’s environmental testing via common qualification to reduce timing, quantities, and costs.

This specification is a general level subsystem light source specification that establishes test requirements of a Gas Discharge Light Source (GDLS) subsystem for use on passenger vehicles.

The completed test data to this test specification is intended to be provided to the OEM by the Tier one lamp set maker as part of the lamp assembly PPAP. Re-testing shall be required if any portion of the approved GDLS experiences a design, manufacturing or component change.

This document shall be applied to systems that meet the requirements for design, performance and validation established by government standards.

The subsystem is defined as the ballast, igniter and light source and shall be tested as a subsystem and considered one test sample for the entire test sequence. A failure of any component in the test sample shall constitute a failure of the entire sample. Substitution or replacement of only the light source shall be allowed during testing. Failure of the light source more than once in a tested system shall constitute a failure of the GDLS. If other manufacture’s components are intended to be approved for use in the GDLS, then those possible combinations of components shall be considered a new GDLS and shall also be tested.

Additional testing may be required by individual OEM’s to meet specific EMC, quality, reliability and durability objectives.

The following tests are to be performed under the following conditions:

Procedures included within this specification are intended to cover performance testing at all phases of development, production, and field analysis of any USB cable assemblies and associated connections that constitute the electrical connection systems between the consumer peripheral interface and the USB computer source in road vehicle applications. These procedures are only applicable to the USB connector and the cable. Unless otherwise specified, all of the tests listed in this specification are for both consumer and nonconsumer interface connectors.

This specification establishes the performance, and validation requirements for the inflator assembly used in airbag modules. Seatbelt Pretensioners are covered as a reference only.

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision).

Failure-Mechanism-Driven Reliability Monitoring draws upon the concepts and implementation of line controls, process stability, and effective monitoring programs in lieu of qualifying a product based solely on a fixed list of tests. A supplier must identify those failure mechanisms that may be actuated through a given product / process change(s), and must design and implement reliability tests adequate to assess the impact of those failure mechanisms on system level reliability. In order for this to be effective, the supplier establishes a thorough understanding of and linkage to their reliability monitoring program. Statistical Reliability Monitoring (SRM) is a statistically based methodology for monitoring and improving reliability; it involves identification and classification of failure mechanisms, development and use of monitors, and investigation of failure kinetics allowing prediction of failure rate at use conditions. Failure kinetics are the characteristics of failure for a given physical failure mechanism, including (where applicable) acceleration factor, derating curve, activation energy, median life, standard deviation, characteristic life, instantaneous failure rate, etc.

The failure rate of semiconductor devices is inherently low. As a result, the semiconductor industry uses a technique called accelerated testing to assess device reliability. Elevated stresses are used to produce the same failure mechanisms as would be observed under normal use conditions, but in a shorter time period. Acceleration factors are used by device manufacturers to estimate failure rates based on the results of accelerated testing. The objective of this testing is to identify these failure mechanisms and eliminate them as a cause of failure during the useful life of the product.

This document provides reference information concerning methods commonly used by the semiconductor industry to estimate failure rates from accelerated test results. These methods are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications.

This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.

This SAE Metric Aerospace Recommended Practice (MAP) establishes the requirements for preparing a specification for fluid couplings for spacecraft servicing. The objective of this document is to provide design, development, verification, storage, and delivery requirement guidelines for the preparation of specifications for fluid couplings and the ancillary hardware for use with serviceable spacecraft designed for use in the space environment. The couplings shall be capable of resupplying storable propellants, cryogenic liquids, and gases to a variety of spacecrafts.

This Aerospace Specification establishes the requirements for a threaded flexible coupling assembly, hereafter referred to as the assembly, which utilizes ferrules or machined tube end fittings to join tubing and components in aircraft fuel, vent, or other systems. This coupling assembly is designed for use from -54 to 93 °C and at 862 kPa peak working pressure. AS coupling components referenced herein have been qualified to AS1710. Ferrule referenced herein are inch ferrules adapted to metric tubing.

This document defines the requirements for a threadless, flexible, self-bonding coupling assembly, which, when installed on machined fixed cavity ferrules, provides a flexible connection for joining tubing and components in aircraft fuel, vent, or other systems. This assembled coupling, hereafter referred to as the assembly, is designed for use from -54 to 204 °C and at 862 kPa operating pressure. AS coupling components referenced herein have been qualified to AS1650. Ferrules referenced herein are inch ferrules adapted to metric tubing.