IEC 60384-22:2019 is available as \/2 which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. <\/p>\n
IEC 60384-22:2019 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384-14. The object of this document is to prescribe preferred ratings and characteristics and to select from IEC 60384-1 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of capacitor. Test severities and requirements prescribed in detail specifications referring to this sectional specification are of equal or higher performance levels, lower performance levels are not permitted. This edition includes the following significant technical changes with respect to the previous edition: – revision of the structure in accordance with ISO\/IEC Directives, Part 2:2016 (seventh edition) to the extent practicable, and for harmonizing with IEC 60384-21; – deletion of the description on the permissible reactive power in 6.2.2 because it is not appropriate for the purposes of this document; – the dimensions of 0201M in Annex A have been added.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 5<\/td>\n | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 4 Information to be given in a detail specification 4.1 General <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 4.2 Outline drawing and dimensions 4.3 Mounting 4.4 Rating and characteristics 4.4.1 General 4.4.2 Nominal capacitance range 4.4.3 Particular characteristics 4.4.4 Soldering <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 4.5 Marking 5 Marking 5.1 General 5.2 Information for marking 5.3 Marking on the body 5.4 Requirements for marking 5.5 Marking of the packaging 5.6 Additional marking 6 Preferred ratings and characteristics 6.1 Preferred characteristics <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | 6.2 Preferred values of ratings 6.2.1 Rated temperature (TR) 6.2.2 Rated voltage (UR) 6.2.3 Category voltage (UC) 6.2.4 Preferred values of nominal capacitance and associated tolerance values Table 1 \u2013 Preferred values of category voltages <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | 6.2.5 Temperature characteristic of capacitance 6.2.6 Dimensions Tables Table 2 \u2013 Preferred tolerances Table 3 \u2013 Temperature characteristic of capacitance <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | 7 Quality assessment procedures 7.1 Primary stage of manufacture 7.2 Structurally similar components 7.3 Certified records of released lots 7.4 Qualification approval 7.4.1 General 7.4.2 Qualification approval on the basis of the fixed sample size procedures <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | 7.4.3 Tests <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | Table 4 \u2013 Fixed sample size test plan for qualification approval \u2013 Assessment level EZ <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | Table 5 \u2013 Tests schedule for qualification approval <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | 7.5 Quality conformance inspection 7.5.1 Formation of inspection lots <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | 7.5.2 Test schedule 7.5.3 Delayed delivery 7.5.4 Assessment levels <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | 8 Test and measurement procedures 8.1 General Table 6 \u2013 Lot-by-lot inspection Table 7 \u2013 Periodic test <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | 8.2 Special preconditioning 8.3 Measuring conditions 8.4 Mounting 8.5 Visual examination and check of dimensions 8.5.1 General 8.5.2 Visual examination 8.5.3 Requirements Figures Figure 1 \u2013 Fault: crack or fissure <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | Figure 2 \u2013 Fault: crack or fissure Figure 3 \u2013 Separation or delamination Figure 4 \u2013 Exposed electrodes <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | 8.6 Electrical tests 8.6.1 Capacitance 8.6.2 Tangent of loss angle (tan \u03b4 ) Figure 5 \u2013 Principal faces Table 8 \u2013 Measuring conditions <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | 8.6.3 Insulation resistance Table 9 \u2013 Tangent of loss angle limits <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | 8.6.4 Voltage proof 8.6.5 Impedance (if required by the detail specification) Table 10 \u2013 Test voltages <\/td>\n<\/tr>\n | ||||||
| 32<\/td>\n | 8.6.6 Equivalent series resistance [ESR] (if required by the detail specification) 8.7 Temperature characteristic of capacitance 8.7.1 Special preconditioning 8.7.2 Measuring conditions <\/td>\n<\/tr>\n | ||||||
| 33<\/td>\n | 8.7.3 Requirements 8.8 Shear test 8.9 Substrate bending test 8.9.1 General Table 11 \u2013 Details of measuring conditions <\/td>\n<\/tr>\n | ||||||
| 34<\/td>\n | 8.9.2 Initial measurement 8.9.3 Final inspection 8.10 Resistance to soldering heat 8.10.1 General 8.10.2 Special preconditioning 8.10.3 Initial measurement 8.10.4 Test conditions <\/td>\n<\/tr>\n | ||||||
| 35<\/td>\n | 8.10.5 Recovery 8.10.6 Final inspection, measurements and requirements Figure 6 \u2013 Reflow temperature profile Table 12 \u2013 Reflow temperature profiles for Sn-Ag-Cu alloy <\/td>\n<\/tr>\n | ||||||
| 36<\/td>\n | 8.11 Solderability 8.11.1 General 8.11.2 Test conditions Table 13 \u2013 Maximum capacitance change <\/td>\n<\/tr>\n | ||||||
| 37<\/td>\n | 8.11.3 Recovery 8.11.4 Final inspection, measurements and requirements 8.12 Rapid change of temperature 8.12.1 General 8.12.2 Special preconditioning 8.12.3 Initial measurement 8.12.4 Number of cycles 8.12.5 Recovery 8.12.6 Final inspection, measurements and requirements <\/td>\n<\/tr>\n | ||||||
| 38<\/td>\n | 8.13 Climatic sequence 8.13.1 General 8.13.2 Special preconditioning 8.13.3 Initial measurement 8.13.4 Dry heat 8.13.5 Damp heat, cyclic, Test Db, first cycle 8.13.6 Cold 8.13.7 Damp heat, cyclic, Test Db, remaining cycles Table 14 \u2013 Maximum capacitance change <\/td>\n<\/tr>\n | ||||||
| 39<\/td>\n | 8.13.8 Final inspection, measurements and requirements 8.14 Damp heat, steady state 8.14.1 General 8.14.2 Special preconditioning 8.14.3 Initial measurement 8.14.4 Test conditions Table 15 \u2013 Number of damp heat cycles Table 16 \u2013 Final inspection, measurements and requirements <\/td>\n<\/tr>\n | ||||||
| 40<\/td>\n | 8.14.5 Recovery 8.14.6 Final inspection, measurements and requirements 8.15 Endurance 8.15.1 General Table 17 \u2013 Test conditions for damp heat, steady state Table 18 \u2013 Final inspection, measurements and requirements <\/td>\n<\/tr>\n | ||||||
| 41<\/td>\n | 8.15.2 Special preconditioning 8.15.3 Initial measurement 8.15.4 Test conditions 8.15.5 Recovery 8.15.6 Final inspection, measurements and requirements Table 19 \u2013 Endurance test conditions (UC = UR) Table 20 \u2013 Endurance test conditions (UC \u2260 UR) <\/td>\n<\/tr>\n | ||||||
| 42<\/td>\n | 8.16 Robustness of terminations (only for capacitors with strip termination) 8.16.1 General 8.16.2 Test conditions 8.16.3 Final inspection and requirements 8.17 Component solvent resistance (if required) 8.18 Solvent resistance of the marking (if required) 8.19 Accelerated damp heat, steady state (if required) 8.19.1 General 8.19.2 Initial measurement Table 21 \u2013 Final inspection, measurements and requirements of endurance test <\/td>\n<\/tr>\n | ||||||
| 43<\/td>\n | 8.19.3 Conditioning 8.19.4 Recovery 8.19.5 Final measurements Table 22 \u2013 Initial requirements Table 23 \u2013 Conditioning <\/td>\n<\/tr>\n | ||||||
| 44<\/td>\n | Annex A (normative) Guidance for the specification and coding of dimensions of fixed surface mount multilayer capacitors of ceramic dielectric, Class 2 Figure A.1 \u2013 Dimensions Table A.1 \u2013 Dimensions <\/td>\n<\/tr>\n | ||||||
| 45<\/td>\n | Annex B (informative) Capacitance ageing of fixed capacitors of ceramic dielectric, Class 2 B.1 General B.2 Law of capacitance ageing <\/td>\n<\/tr>\n | ||||||
| 46<\/td>\n | B.3 Capacitance measurements and capacitance tolerance B.4 Special preconditioning (see 8.2) <\/td>\n<\/tr>\n | ||||||
| 47<\/td>\n | Annex C (informative) Temperature characteristics of capacitance for the reference temperature of 25 \u00b0C Table C.1 \u2013 Temperature characteristics of capacitance for the reference temperature of 25 \u00b0C Table C.2 \u2013 Measuring conditions of temperature characteristic of capacitance for the reference temperature of 25 \u00b0C <\/td>\n<\/tr>\n | ||||||
| 48<\/td>\n | Annex X (informative) Cross-reference for reference to IEC 60384-22:2011 Table X.1 \u2013 Reference to IEC 60384-22 for clause\/subclause Table X.2 \u2013 Reference to IEC 60384-22 for figure\/table <\/td>\n<\/tr>\n | ||||||
| 49<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Fixed capacitors for use in electronic equipment – Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2<\/b><\/p>\n |