{"id":233652,"date":"2024-10-19T15:14:06","date_gmt":"2024-10-19T15:14:06","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-iec-62153-4-102015\/"},"modified":"2024-10-25T09:44:29","modified_gmt":"2024-10-25T09:44:29","slug":"bs-iec-62153-4-102015","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-iec-62153-4-102015\/","title":{"rendered":"BS IEC 62153-4-10:2015"},"content":{"rendered":"
IEC 62153-4-10:2015(E) details a coaxial method suitable for determining the transfer impedance and\/or screening attenuation of feed-throughs and electromagnetic gaskets. The shielded screening attenuation test set-up according to IEC 62153-4-4 (triaxial method) has been modified to take into account the particularities of feed-throughs and gaskets. This second edition cancels and replaces the first edition published in 2009. It constitutes a technical revision. The main technical changes with regard to the previous edition are as follows: – addition of a new clause that describes a procedure for verification of the measurement set-up and further information regarding sample preparation; – addition of a new Annex that describes how to improve measurement certainty in the very low frequency area.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
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4<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
6<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | Figures Figure 1 \u2013 A two-port Figure\u00a02 \u2013 Equivalent circuit of the test set-up and definition of ZT <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 4 Principle of the test method <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | Figure 3 \u2013 Cross-section of a typical feed-through configuration Figure 4 \u2013 Cross-section of the test fixture with a connector <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | Figure 5 \u2013 Cross-section of the test fixture with an electromagnetic gasket <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 5 Procedure 5.1 Equipment 5.2 Dynamic range 5.3 Verification of the test set-up 5.4 Sample preparation 6 Measurement 6.1 General 6.2 Screening attenuation 6.3 Transfer impedance <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 7 Expression of results 7.1 Transfer impedance 7.2 Screening attenuation 7.3 Requirements <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Annex A (informative) Background for the measurement of the shielding effectiveness of feed-throughs and electromagnetic gaskets A.1 General Figure A.1 \u2013 Cross-section of a typical feed-through configuration <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | A.2 Theoretical model of the test procedure Figure A.2 \u2013 Cross-section of the test fixture with a connector Figure A.3 \u2013 Equivalent circuit of the test setup with the shunt admittance y of the feed-through <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | A.3 Performing measurements A.3.1 Characteristic impedance uniformity of the test fixture A.3.2 Measuring EMI-gaskets by using a NWA Figure A.4 \u2013 TDR step response at input-port of test fixture <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | A.3.3 Pictures and measurement results <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | Figure A.5 \u2013 View of the test fixture connected to a network analyzer Figure A.6 \u2013 Top view of the test fixture Figure A.7 \u2013 Detailed view of the contact area <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | Figure A.8 \u2013 Detailed view of the captivation for the conductive O-ring test <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | Figure A.9 \u2013 Isolation of the network analyzer Figure A.10 \u2013 Isolation of the test fixture when characterizing an ideal short (metal plate) <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | Figure A.11 \u2013 Measured operational screening transmission when characterizing a typical conductive O-ring Figure A.12 \u2013 Transfer impedance ZT of a typical conductive O-ring <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | Figure A.13 \u2013 Screening attenuation as of a typical conductive O-ring <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | Annex B (informative) Reference device for verification measurement B.1 General B.2 Design of the reference device Figure B.1 \u2013 Reference device, e.g. resistors soldered onto a PCB <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | B.3 Verification measurement result Figure B.2 \u2013 Typical verification measurement result <\/td>\n<\/tr>\n | ||||||
27<\/td>\n | Annex C (informative) Impact of ground loops on low frequency measurements C.1 General C.2 Analysis of the test set-up Figure C.1 \u2013 Double coaxial test set-up <\/td>\n<\/tr>\n | ||||||
28<\/td>\n | Figure C.2 \u2013 Equivalent circuits of the double coaxial test set-up <\/td>\n<\/tr>\n | ||||||
29<\/td>\n | Figure C.3 \u2013 Results obtained with (green) and without ferrites on the test leads (blue) <\/td>\n<\/tr>\n | ||||||
30<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Metallic communication cable test methods – Electromagnetic compatibility (EMC). Transfer impedance and screening attenuation of feed-throughs and electromagnetic gaskets. Double coaxial test method<\/b><\/p>\n |