{"id":233859,"date":"2024-10-19T15:15:05","date_gmt":"2024-10-19T15:15:05","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-60749-42017\/"},"modified":"2024-10-25T09:46:03","modified_gmt":"2024-10-25T09:46:03","slug":"bs-en-60749-42017","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-60749-42017\/","title":{"rendered":"BS EN 60749-4:2017"},"content":{"rendered":"
This part of IEC 60749 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments.<\/p>\n
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2<\/td>\n | National foreword <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions 4 HAST test \u2013 General remarks <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 5 Test apparatus 5.1 Test apparatus requirements 5.2 Controlled conditions 5.3 Temperature profile 5.4 Devices under stress 5.5 Minimize release of contamination 5.6 Ionic contamination 5.7 De-ionized water 6 Test conditions 6.1 Test conditions requirements <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 6.2 Biasing guidelines Table 1 \u2013 Temperature, relative humidity and duration requirements <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 6.3 Choosing and reporting 7 Procedure 7.1 Test device mounting 7.2 Ramp-up 7.3 Ramp-down 7.4 Test clock 7.5 Bias Table 2 \u2013 Bias and reporting requirements <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 7.6 Readout 7.7 Handling 7.8 Calibration records 8 Failure criteria 9 Safety 10 Summary <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Semiconductor devices. Mechanical and climatic test methods – Damp heat, steady state, highly accelerated stress test (HAST)<\/b><\/p>\n |