{"id":236326,"date":"2024-10-19T15:25:25","date_gmt":"2024-10-19T15:25:25","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-60068-2-832011\/"},"modified":"2024-10-25T10:02:21","modified_gmt":"2024-10-25T10:02:21","slug":"bs-en-60068-2-832011","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-60068-2-832011\/","title":{"rendered":"BS EN 60068-2-83:2011"},"content":{"rendered":"

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass – fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
6<\/td>\nEnglish
\n
CONTENTS <\/td>\n<\/tr>\n
8<\/td>\nFOREWORD <\/td>\n<\/tr>\n
10<\/td>\nINTRODUCTION <\/td>\n<\/tr>\n
12<\/td>\n1 Scope
2 Normative references
3 Terms and definitions <\/td>\n<\/tr>\n
13<\/td>\n4 Test
4.1 General description
4.2 Test methods
5 Preconditioning <\/td>\n<\/tr>\n
14<\/td>\n6 Preparation
6.1 Solder paste
6.2 Test jig plate
6.3 Specimen holder
7 Quick heating method
7.1 Equipment <\/td>\n<\/tr>\n
15<\/td>\n7.2 Test jig plate
Figures
\n
Figure 1 \u2013 Examples of the quick heating method test equipment
Tables
\n
Table 1 \u2013 Specification of the test jig plate for quick heating and synchronous method <\/td>\n<\/tr>\n
16<\/td>\n7.3 Preparation
7.4 Test condition
Figure 2 \u2013 Example of test jig plate for quick heating and synchronous method <\/td>\n<\/tr>\n
17<\/td>\nFigure 3 \u2013 Example of the temperature profile <\/td>\n<\/tr>\n
18<\/td>\n7.5 Test procedure
Figure 4 \u2013 Example of applying solder paste to a test jig plate
Table 2 \u2013 Recommended test conditions of the quick heatingand synchronous method for rectangular SMD <\/td>\n<\/tr>\n
19<\/td>\n7.6 Presentation of the result
7.7 Characterisation parameter examples
Figure 5 \u2013 Typical output shape of signal in the quick heating method <\/td>\n<\/tr>\n
20<\/td>\n8 Synchronous method
8.1 Equipment
Figure 6 \u2013 Example of synchronous method test equipment <\/td>\n<\/tr>\n
21<\/td>\n8.2 Test jig plate
8.3 Synchronous fixture
8.4 Preparation
8.5 Test condition
8.6 Test procedure
Figure 7 \u2013 Example of synchronous fixture <\/td>\n<\/tr>\n
22<\/td>\n8.7 Presentation of the results
Figure 8 \u2013 Typical output shape of signal in the synchronous method <\/td>\n<\/tr>\n
23<\/td>\n8.8 Characterisation parameter examples
9 Temperature profile method
9.1 Equipment
9.2 Test jig plate
Figure 9 \u2013 Example of the system for temperature profile method test equipment <\/td>\n<\/tr>\n
24<\/td>\n9.3 Preparation
9.4 Test condition
Figure 10 \u2013 Example of the temperature profile
Table 3 \u2013 Specification of the test jig plate of the temperature profile method <\/td>\n<\/tr>\n
25<\/td>\n9.5 Test procedure
Table 4 \u2013 Recommended test conditions of the temperatureprofile method for rectangular SMD <\/td>\n<\/tr>\n
26<\/td>\n9.6 Presentation of the result
Figure 11 \u2013 Example of applying solder paste to a test jig plate <\/td>\n<\/tr>\n
27<\/td>\n9.7 Characterisation parameter examples
Figure 12 \u2013 Typical output shape of signal in the temperature profile method <\/td>\n<\/tr>\n
28<\/td>\nAnnex A (normative)
\nEquipment for the quick heating and synchronous method <\/td>\n<\/tr>\n
29<\/td>\nAnnex B (informative) Reading of the output data and correction of the result
\nin the quick heating test <\/td>\n<\/tr>\n
30<\/td>\nFigure B.1 \u2013 Typical wetting force changes in quick heating method <\/td>\n<\/tr>\n
31<\/td>\nFigure B.2 \u2013 Example of correction of the initial time of wetting (Fa is larger than 0,5F1,max)
Figure B.3 \u2013 Example of correction of the initial time of wetting (Fa is 0,5F1,max or less) <\/td>\n<\/tr>\n
32<\/td>\nAnnex C (normative)
\nTest equipment for the temperature profile method <\/td>\n<\/tr>\n
33<\/td>\nAnnex D (informative) Reading of the output data and correction of the result
\nin the temperature profile test <\/td>\n<\/tr>\n
34<\/td>\nFigure D.1 \u2013 Typical output forms for profile temperature test <\/td>\n<\/tr>\n
35<\/td>\nFigure D.2 \u2013 The case when an extruding force (1,1Fmax or larger)is generated immediately after the beginning of wetting <\/td>\n<\/tr>\n
36<\/td>\nAnnex E (informative)
\nCaveats \/ Notes <\/td>\n<\/tr>\n
37<\/td>\nFigure E.1 \u2013 Explanation diagram of test procedure for the quick heating method <\/td>\n<\/tr>\n
38<\/td>\nFigure E.2 \u2013 Explanation diagram of test procedure for synchronous method
Figure E.3 \u2013 Showing the wetting force (pull) of some solder pastes <\/td>\n<\/tr>\n
39<\/td>\nFigure E.4 \u2013 Explanation diagram of the test procedure for the temperature profile method <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Environmental testing – Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2011<\/td>\n42<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":236329,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-236326","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/236326","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/236329"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=236326"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=236326"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=236326"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}