{"id":318634,"date":"2024-10-19T22:00:40","date_gmt":"2024-10-19T22:00:40","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-iso-218592019\/"},"modified":"2024-10-25T20:18:34","modified_gmt":"2024-10-25T20:18:34","slug":"bs-iso-218592019","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-iso-218592019\/","title":{"rendered":"BS ISO 21859:2019"},"content":{"rendered":"<p>This document specifies a test method for plasma resistance of ceramic components in semiconductor manufacturing equipment. It is applicable to ceramic components of plasma-resistant components in dry etching chambers used in semiconductor manufacturing.<\/p>\n<h4>PDF Catalog<\/h4>\n<table border=\"1px\" class=\"des-table\">\n<tr>\n<th>PDF Pages<\/th>\n<th>PDF Title<\/th>\n<\/tr>\n<tr>\n<td><b>2<b><\/td>\n<td>National foreword  <\/td>\n<\/tr>\n<tr>\n<td><b>6<b><\/td>\n<td>Foreword  <\/td>\n<\/tr>\n<tr>\n<td><b>7<b><\/td>\n<td>1 Scope <br \/> 2 Normative references <br \/> 3 Terms and definitions <br \/> 4 Principle of measurement  <\/td>\n<\/tr>\n<tr>\n<td><b>8<b><\/td>\n<td>5 Test environment <br \/> 6 Apparatus <br \/> 6.1 Plasma-etching equipment <br \/> 6.2 Contact-probe profilometer <br \/> 6.3 Surface roughness profilometer <br \/> 7 Test pieces <br \/> 7.1 General consideration <br \/> 7.2 Surface conditions <br \/> 8 Procedure <br \/> 8.1 Measurement of surface roughness before a plasma resistance test  <\/td>\n<\/tr>\n<tr>\n<td><b>9<b><\/td>\n<td>8.2 Masking <br \/> 8.3 Plasma resistance test <br \/> 8.3.1 Setting of test pieces <br \/> 8.3.2 Test conditions <br \/> 8.4 Measurement of erosion depth <br \/> 8.5 Measurement of surface roughness after the plasma resistance test <br \/> 9 Calculation <br \/> 9.1 Calculation of mean erosion depth  <\/td>\n<\/tr>\n<tr>\n<td><b>10<b><\/td>\n<td>9.2 Calculation of surface roughness <br \/> 10 Test report  <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p><b>Fine ceramics (advanced ceramics, advanced technical ceramics). Test method for plasma resistance of ceramic components in semiconductor manufacturing equipment<\/b><\/p>\n<table class=\"shortdes-table\" style=\"width: 100%\" border=\"0\" cellspacing=\"0\" cellpadding=\"0\">\n<tbody>\n<tr>\n<td>Published By<\/td>\n<td>Publication Date<\/td>\n<td>Number of Pages<\/td>\n<\/tr>\n<tr>\n<td><a href=\"https:\/\/pdfstandards.shop\/product-category\/publishers\/bsi\/\"><b>BSI<\/b><\/a><\/td>\n<td>2019<\/td>\n<td>12<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":318641,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[1164,2641],"product_tag":[],"class_list":{"0":"post-318634","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-81-060-30","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/318634","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/318641"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=318634"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=318634"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=318634"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}