{"id":372128,"date":"2024-10-20T02:27:53","date_gmt":"2024-10-20T02:27:53","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-61760-32021\/"},"modified":"2024-10-26T04:17:35","modified_gmt":"2024-10-26T04:17:35","slug":"bs-en-iec-61760-32021","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-61760-32021\/","title":{"rendered":"BS EN IEC 61760-3:2021"},"content":{"rendered":"

This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology. The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended. Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
5<\/td>\nAnnex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n
7<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
9<\/td>\nFOREWORD <\/td>\n<\/tr>\n
11<\/td>\n1 Scope
2 Normative references <\/td>\n<\/tr>\n
12<\/td>\n3 Terms and definitions <\/td>\n<\/tr>\n
14<\/td>\n4 Requirements to component design and component specifications
4.1 General requirement
4.2 Packaging
Figures
Figure 1 \u2013 Example of a component with marked specific orientation put in tape and tray <\/td>\n<\/tr>\n
15<\/td>\n4.3 Labelling of component packaging
4.4 Component marking
4.5 Storage and transportation
4.6 Component outline and design
4.6.1 Drawing and specification
Figure 2 \u2013 Example of components in a tape <\/td>\n<\/tr>\n
16<\/td>\n4.6.2 Requirement of pick-up area <\/td>\n<\/tr>\n
17<\/td>\nFigure 3 \u2013 Pick-up area
Figure 4 \u2013 Chuck jaw <\/td>\n<\/tr>\n
18<\/td>\n4.6.3 Component tilt
4.6.4 Bottom surface requirements
Figure 5 \u2013 Component side flat surface
Figure 6 \u2013 Component top flat surface <\/td>\n<\/tr>\n
19<\/td>\n4.6.5 Terminal requirements
Figure 7 \u2013 Clearance
Figure 8 \u2013 Stand-off height <\/td>\n<\/tr>\n
20<\/td>\nFigure 9 \u2013 Terminal length and protrusion length <\/td>\n<\/tr>\n
21<\/td>\nFigure 10 \u2013 Terminal position tolerance 0,2 mm <\/td>\n<\/tr>\n
22<\/td>\nFigure 11 \u2013 Terminal position tolerance 0,4 mm <\/td>\n<\/tr>\n
23<\/td>\nFigure 12 \u2013 Terminal shape <\/td>\n<\/tr>\n
24<\/td>\n4.6.6 Optical recognition
4.6.7 Component height
Figure 13 \u2013 Solder wetting <\/td>\n<\/tr>\n
25<\/td>\n4.6.8 Component mass
4.7 Mechanical stress
4.8 Component reliability
4.9 Additional requirements for compatibility with lead-free soldering
5 Typical process conditions for THR soldering process
5.1 Mounting by through-hole reflow soldering <\/td>\n<\/tr>\n
26<\/td>\n5.2 Solder paste supply
Figure 14 \u2013 Typical soldering process steps <\/td>\n<\/tr>\n
27<\/td>\n5.3 Component insertion
5.4 Reflow soldering methods (recommended)
Figure 15 \u2013 Solder paste supply <\/td>\n<\/tr>\n
28<\/td>\n5.5 Cleaning
5.5.1 General
5.5.2 Cleaning medium and cleaning method
5.5.3 Cleaning process conditions <\/td>\n<\/tr>\n
29<\/td>\n5.6 Removal and\/or replacement of soldered components
6 Relevant tests and requirements for components and component specifications for THR soldering process
6.1 General
Tables
Table 1 \u2013 Typical cleaning conditions <\/td>\n<\/tr>\n
30<\/td>\n6.2 Wettability
6.3 Dewetting
6.4 Resistance to soldering heat
6.5 Resistance to cleaning solvent
6.5.1 General <\/td>\n<\/tr>\n
31<\/td>\n6.5.2 Solvent resistance of component
6.5.3 Solvent resistance of marking
6.6 Soldering profile
6.7 Moisture sensitivity level
7 Quality criteria for THR soldering <\/td>\n<\/tr>\n
32<\/td>\nFigure A.1 \u2013 Example of the flux creeping-up
Figure A.2 \u2013 Example of the solder wicking <\/td>\n<\/tr>\n
33<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Surface mounting technology – Standard method for the specification of components for through-hole reflow (THR) soldering<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2021<\/td>\n34<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":372137,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-372128","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/372128","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/372137"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=372128"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=372128"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=372128"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}