{"id":382294,"date":"2024-10-20T03:15:26","date_gmt":"2024-10-20T03:15:26","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-60068-2-202021-tc\/"},"modified":"2024-10-26T05:55:28","modified_gmt":"2024-10-26T05:55:28","slug":"bs-en-iec-60068-2-202021-tc","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-60068-2-202021-tc\/","title":{"rendered":"BS EN IEC 60068-2-20:2021 – TC"},"content":{"rendered":"

IEC 60068-2-20:2021 is available as IEC 60068-2-20:2021 RLV<\/span> which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60068-2-20:2021 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068?2?58. This document provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this document include the solder bath method and soldering iron method. The objective of this document is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can be resistant to the heat load to which it is exposed during soldering. This edition includes the following significant technical changes with respect to the previous edition: – update of and clarification of pre-conditioning (former “aging”) and its relation to natural aging.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
30<\/td>\nundefined <\/td>\n<\/tr>\n
33<\/td>\nAnnex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n
35<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
37<\/td>\nFOREWORD <\/td>\n<\/tr>\n
39<\/td>\n1 Scope
2 Normative references
3 Terms and definitions <\/td>\n<\/tr>\n
40<\/td>\nFigure 1 \u2013 Diagram of contact angle <\/td>\n<\/tr>\n
41<\/td>\n4 Test Ta: Solderability of wire and tag terminations
4.1 Objective and general description of the test
4.1.1 Test methods
4.1.2 Specimen preparation <\/td>\n<\/tr>\n
42<\/td>\n4.1.3 Initial measurements
4.1.4 Preconditioning <\/td>\n<\/tr>\n
43<\/td>\n4.2 Method 1: Solder bath
4.2.1 General
4.2.2 Description of the solder bath
4.2.3 Flux
4.2.4 Procedure <\/td>\n<\/tr>\n
44<\/td>\n4.2.5 Test conditions
4.2.6 Final measurements and requirements
4.3 Method 2: Soldering iron at 350 \u00b0C
4.3.1 General
4.3.2 Description of soldering iron
Table 1 \u2013 Solderability, solder bath method: Test severities (duration and temperature) <\/td>\n<\/tr>\n
45<\/td>\n4.3.3 Solder and flux
4.3.4 Procedure
Figure 2 \u2013 Position of soldering iron <\/td>\n<\/tr>\n
46<\/td>\n4.3.5 Final measurements and requirements
4.4 Information to be given in the relevant specification <\/td>\n<\/tr>\n
47<\/td>\n5 Test Tb: Resistance to soldering heat
5.1 Objective and general description of the test
5.1.1 Test methods
5.1.2 Initial measurements
5.2 Method 1: Solder bath
5.2.1 Description of the solder bath
5.2.2 Flux
5.2.3 Procedure <\/td>\n<\/tr>\n
48<\/td>\n5.2.4 Test conditions
5.2.5 De-wetting
Table 2 \u2013 Resistance to soldering heat, solder bath method:Test severities (duration and temperature) <\/td>\n<\/tr>\n
49<\/td>\n5.3 Method 2: Soldering iron
5.3.1 Description of soldering iron
5.3.2 Solder and flux
5.3.3 Procedure
5.4 Recovery
5.5 Final measurements and requirements
5.6 De-wetting (if required) <\/td>\n<\/tr>\n
50<\/td>\n5.7 Information to be given in the relevant specification <\/td>\n<\/tr>\n
51<\/td>\nFigure A.1 \u2013 Example of apparatus <\/td>\n<\/tr>\n
53<\/td>\nTable B.1 \u2013 Colophony based flux compositions <\/td>\n<\/tr>\n
54<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Tracked Changes. Environmental testing – Tests. Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2021<\/td>\n56<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":382299,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[558,2641],"product_tag":[],"class_list":{"0":"post-382294","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-31-040-10","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/382294","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/382299"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=382294"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=382294"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=382294"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}