{"id":421907,"date":"2024-10-20T06:38:40","date_gmt":"2024-10-20T06:38:40","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-iec-tr-61189-5-5062019-2\/"},"modified":"2024-10-26T12:26:00","modified_gmt":"2024-10-26T12:26:00","slug":"bsi-pd-iec-tr-61189-5-5062019-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-iec-tr-61189-5-5062019-2\/","title":{"rendered":"BSI PD IEC TR 61189-5-506:2019"},"content":{"rendered":"
This Technical Report is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-\u00b5m gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 \u00b5m and 500 \u00b5m.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
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2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
4<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
6<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions 4 Test board concept for intercomparison 4.1 The need for a fine-pitch SIR pattern <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 4.2 Test board design <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 4.3 Test board fluxing Figures Figure 1 \u2013 TB144 Tables Table 1 \u2013 SIR pattern information <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 5 Test procedure for intercomparison 5.1 Sample preparation Table 2 \u2013 Flux to be used for SIR evaluation test Table 3 \u2013 Samples for SIR evaluation testing <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 5.2 Preparation of samples for humidity chamber 5.3 Placement of samples inside the humidity chamber Figure 2 \u2013 Connector arrangement <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 5.4 Resistance measurements 5.5 Evaluation of results 5.6 Additional information 6 Results Figure 3 \u2013 Sample orientation in test chamber <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | Figure 4 \u2013 Participants’ (a to f) resistance measurements for the six test patterns on the checkerboard Figure 5 \u2013 Participant A control boards <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Figure 6 \u2013 Participant A flux loaded boards Figure 7 \u2013 Participant B control boards Figure 8 \u2013 Participant B flux loaded boards <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | Figure 9 \u2013 Participant C control boards Figure 10 \u2013 Participant C flux loaded boards Figure 11 \u2013 Participant D control boards <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | Figure 12 \u2013 Participant D flux loaded boards Figure 13 \u2013 Participant E control boards Figure 14 \u2013 Participant E flux loaded boards <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | Figure 15 \u2013 Participant F control boards Figure 16 \u2013 Participant F flux loaded boards Figure 17 \u2013 Participant G control boards <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | Figure 18 \u2013 Participant G flux loaded boards Figure 19 \u2013 Participant D, and evidence of a fibre and the effect on the SIR Figure 20 \u2013 Participant E and evidence of corrosion shorting across the gap <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | Figure 21 \u2013 Participant G and evidence of a water droplet and the resulting drop in SIR and dendrite like failure Figure 22 \u2013 Participant G and a corrosion defect probably from a flux residue Figure 23 \u2013 Participant C dendrites and corrosions formed on all SIR patternsof all fluxed samples tested at 85\u00b0C\/85% <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | Figure 24 \u2013 The average final SIR value for the control boards Figure 25 \u2013 The average final SIR value for the flux loaded boards <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | Figure 26 \u2013 The average final SIR for flux-loaded patterns by participant Figure 27 \u2013 Final SIR plotted as ohm.squares <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | Figure 28 \u2013 Ratio of the log \u03a9.square value to the 500-\u00b5m pattern <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Test methods for electrical materials, printed boards and other interconnection structures and assemblies – General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501<\/b><\/p>\n |