This European standard establishes uniform requirements for Packaging for the Common Functional Modules (CFM) within an Integrated Modular Avionic (IMA) system. It comprises the module physical properties and the Module Physical Interface (MPI) definitions together with guidelines for IMA rack and the operational environment.<\/p>\n
The characteristics addressed by the Packaging Standard are:<\/p>\n
Interchangeability:<\/p>\n
For a given cooling method all modules conforming to the packaging standard will function correctly when inserted into any rack slot conforming to the standard for the cooling method.<\/p>\n<\/li>\n
All modules conforming to the Module Physical Interface (MPI) definitions for connector, IED and cooling interface will function correctly when inserted into any rack slot conforming to the same MPI definition.<\/p>\n<\/li>\n<\/ul>\n
Maintainability:<\/p>\n
All modules are easily removable at first line.<\/p>\n<\/li>\n
No special tools required at first line.<\/p>\n<\/li>\n
No manual adjustment is necessary when installing modules. No tool is required for installation or removal of the modules.<\/p>\n<\/li>\n
Mechanical keying is provided that prevents insertion of a module into a rack slot that may cause an unsafe condition.<\/p>\n<\/li>\n<\/ul>\n
The Module Physical Interface definition, contained within this standard, does not include the properties of the signalling used in the optical interface (e. g. wavelength). These are covered in EN 4660-003.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 6<\/td>\n | Introduction <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | 3 Terms and definitions and abbreviations 3.1 General 3.2 Abbreviations <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | 3.3 Precedence 3.4 Terms and definitions 3.4.1 General terms <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | 3.4.2 Module mechanical items <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 3.4.3 Tolerances 4 Generic module specification 4.1 Introduction <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 4.2 Module description 4.3 Module physical specification 4.3.1 Module envelope: height, length, width <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 4.3.2 Module distortion 4.3.3 Module mass 4.3.4 Module insertion and extraction 4.3.5 Electrical safety <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 4.3.6 Materials 4.3.6.1 Use of flammable materials 4.3.6.2 Finishes and protective treatments <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | 4.3.7 Module Identification 4.3.7.1 General 4.3.7.2 Module key code 4.3.7.3 Module part number <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | 4.3.7.4 Module certification mark 4.3.7.5 Module name and type 4.3.7.6 Vendor’s module identification 4.3.7.7 Module serial number 4.3.7.8 Module date code 4.4 Module physical interface \u2014 connector 4.4.1 General <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | 4.4.2 Connector shell dimensions 4.4.3 Module connector shell location 4.4.4 Connector cavities, inserts, ferrules and contacts 4.4.4.1 General 4.4.4.2 Identification <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | 4.4.4.3 Insert allocation 4.4.4.4 \u201cGuided Optical\u201d inserts and ferrules <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | 4.4.4.5 Electrical signal contacts 4.4.4.6 Electrical – power contacts 4.4.5 Mating sequence 4.4.6 Guide pins and sockets 4.4.7 Keying <\/td>\n<\/tr>\n | ||||||
| 23<\/td>\n | 4.4.8 Environmental protection and cleaning 4.5 Module physical interface cooling <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | 4.6 Module physical interface \u2013 Insertion extraction device 5 Module mechanical tests 5.1 General 5.2 Master gauge test 5.3 Module insertion and extraction 5.3.1 General 5.3.2 Module insertion <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | 5.3.3 Module extraction 5.3.4 Durability 5.3.5 Keying pin integrity 5.3.6 Module header torque 5.3.7 Module cantilever load <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | 6 Guidelines for a rack slot 6.1 General 6.2 Rack slot design requirements 6.2.1 Slot description 6.2.2 Slot physical dimensions 6.2.3 Materials 6.2.4 Anodic treatment and plating 6.2.5 Slot marking 6.2.5.1 Slot identifier 6.2.5.2 Module key code 6.3 Connector interface <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | 6.4 Cooling requirements 6.5 Relationship between cooling, connector and IED rack interfaces 7 Typical modular avionics environment 7.1 General <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | 7.2 Ambient pressure (altitude) 7.3 Humidity <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | 7.4 High and low temperatures 7.4.1 General 7.4.2 Temperature environmental conditions <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | 7.4.3 Storage temperatures 7.5 Thermal shocks 7.6 Salt spray 7.7 Vibrations 7.7.1 General <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | 7.7.2 Sinusoidal vibrations 7.7.3 Random vibrations 7.7.4 Gunfire vibrations 7.7.5 Combined vibrations (Helicopter) <\/td>\n<\/tr>\n | ||||||
| 32<\/td>\n | 7.8 Accelerations 7.8.1 General 7.8.2 Rotational accelerations 7.8.3 Transversal accelerations 7.9 Mechanical shocks 7.9.1 General <\/td>\n<\/tr>\n | ||||||
| 33<\/td>\n | 7.9.2 Functional shocks 7.9.3 Bench handling 7.9.4 Crash hazard 7.9.5 Catapult launch, arrested landing 7.10 Contamination resistance <\/td>\n<\/tr>\n | ||||||
| 34<\/td>\n | 7.11 Flame resistance 7.12 Fungus resistance 7.13 Rain 7.14 Acoustic noise 7.15 Electromagnetic environment <\/td>\n<\/tr>\n | ||||||
| 35<\/td>\n | 7.16 Explosive atmosphere 7.17 Nuclear, Biological and Chemical (NBC) hazards 7.17.1 General 7.17.2 Nuclear threats <\/td>\n<\/tr>\n | ||||||
| 36<\/td>\n | 7.17.3 Nuclear radiation 7.17.3.1 General 7.17.3.2 Nuclear hardening 7.17.4 Biological and chemical <\/td>\n<\/tr>\n | ||||||
| 37<\/td>\n | 7.19 Single event upset\/multiple bit upset 7.20 Module tempest <\/td>\n<\/tr>\n | ||||||
| 38<\/td>\n | Annex A (informative)Standard evolution form <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Aerospace series. Modular and open avionics architectures – Packaging<\/b><\/p>\n |