{"id":452240,"date":"2024-10-20T09:23:17","date_gmt":"2024-10-20T09:23:17","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iso-9455-172024-tc\/"},"modified":"2024-10-26T17:29:24","modified_gmt":"2024-10-26T17:29:24","slug":"bs-en-iso-9455-172024-tc","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iso-9455-172024-tc\/","title":{"rendered":"BS EN ISO 9455-17:2024 – TC"},"content":{"rendered":"
This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin\/lead (Sn\/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453). This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.<\/p>\n
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1<\/td>\n | 30486924 <\/td>\n<\/tr>\n | ||||||
40<\/td>\n | A-30450738 <\/td>\n<\/tr>\n | ||||||
41<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
53<\/td>\n | 7.1 Surface plating 7.1.1 Slivering (thin metal overhang on etch runs) <\/td>\n<\/tr>\n | ||||||
54<\/td>\n | 7.1.2 Plating nodules 7.1.3 Plating pits 7.2 Surface laminate 8.1 Preparation of the flux test solution 8.1.1 Liquid flux samples 8.1.2 Solid flux samples 8.1.3 Flux-cored solder wire or preform samples <\/td>\n<\/tr>\n | ||||||
55<\/td>\n | 8.1.4 Solder paste samples 8.1.5 Paste flux samples 8.2 Preparation of the test coupons 8.2.1 Sample identification 8.2.2 Test coupons <\/td>\n<\/tr>\n | ||||||
56<\/td>\n | 8.2.3 Test coupon pre-cleaning 9.1 Methods for connecting test coupons 9.1.1 Board circuitry layout <\/td>\n<\/tr>\n | ||||||
58<\/td>\n | 9.1.2 Preconditioning of SIR test coupons prior to processing (optional) 9.2 Fluxing and soldering test patterns 9.2.1 Liquid and solid flux samples and flux-cored solder wire samples 9.2.2 Soldering using wave solder system 9.2.3 Soldering using static solder pot <\/td>\n<\/tr>\n | ||||||
59<\/td>\n | 9.2.4 Solder paste samples 9.2.5 Paste flux samples 9.3 Cleaning <\/td>\n<\/tr>\n | ||||||
60<\/td>\n | 9.4 SIR measurement 9.4.1 High-resistance measurement system verification 9.4.2 Test coupon measurements 9.5 Electrochemical migration test <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Tracked Changes. Soft soldering fluxes. Test methods – Surface insulation resistance comb test and electrochemical migration test of flux residues<\/b><\/p>\n |