ASTM-F487 2018
$35.75
F487-13(2018) Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding
| Published By | Publication Date | Number of Pages |
| ASTM | 2018 | 4 |
ASTM F487-13-Reapproved2018
Withdrawn Standard: Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024)
ASTM F487
Scope
1.1 This specification covers aluminum–1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 μm (0.003 in.). For diameters larger than 76 μm (0.003 in.), the specifications are to be agreed upon between the purchaser and the supplier.
1.2 The values stated in SI units are to be regarded as the standard, regardless of whether they appear first or second in a table. Values given in parentheses are for information only.
1.3 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
Keywords
silicon aluminum wire; wire bonding;
ICS Code
ICS Number Code 29.060.10 (Wires)
DOI: 10.1520/F0487-13R18
