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BS EN IEC 62321-2:2021

BS EN IEC 62321-2:2021

$198.66

Determination of certain substances in electrotechnical products – Disassembly, disjointment and mechanical sample preparation

Published By Publication Date Number of Pages
BSI 2021 58
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This part of IEC 62321 provides strategies of sampling along with the mechanical preparation of samples from electrotechnical products. These samples can be used for analytical testing to determine the levels of certain substances as described in the test methods in other parts of the IEC 62321 series. Restrictions for substances will vary between geographic regions and can be updated on a regular basis. This document describes a generic process for obtaining and preparing samples prior to the determination of any substance of concern. This document does not provide: – full guidance on each and every product that could be classified as electrotechnical product. Since there is a huge variety of electrotechnical parts, with various structures and compositions, along with the continuous innovations in the industry, it is unrealistic to attempt to provide procedures for the disjointment of every type of part; – guidance regarding other routes to gather additional information on certain substances in a product, although the information collected has relevance to the sampling strategies in this document; – safe disassembly and mechanical disjointment instructions related to electrotechnical products (e.g. mercury-containing switches) and the recycling industry (e.g. how to handle CRTs or the safe removal of batteries). See IEC 62554 [1] 1 for the disjointment and mechanical sample preparation of mercury-containing fluorescent lamps; – sampling procedures for packaging and packaging materials; – analytical procedures to measure the levels of certain substances. This is covered by other standards (e.g. other parts of the IEC 62321 series), which are referred to as “test standards” in this document; – guidelines for assessment of compliance. This document has the status of a horizontal standard in accordance with IEC Guide 108 [2].

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
7 English
CONTENTS
10 FOREWORD
12 INTRODUCTION
13 1 Scope
2 Normative references
14 3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
3.2 Abbreviated terms
15 4 Introduction to sampling
4.1 Introductory remarks
4.2 Requirements for certain substances
16 4.3 Complexity of electrotechnical products and related challenges
17 4.4 Sampling procedure
Figures
Figure 1 – Generic iterative procedure for sampling strategy
18 4.5 Scope of the analysis
19 4.6 Purpose of the analysis
4.7 Testing strategy
20 5 Sampling plan
5.1 Introductory remarks
5.2 Sampling of a complete product
21 5.3 Partial disassembly
5.4 Complete disassembly
5.5 Partial disjointment
5.6 Complete disjointment
22 5.7 Test sample considerations
5.7.1 Introductory remarks
5.7.2 Required sample size
Tables
Table 1 – Minimum number of lead frame samples required for analytical testing
23 5.7.3 Sample size versus detection limit
24 5.7.4 Composite sample considerations
5.7.5 Non-uniform “homogeneous materials”
Table 2 – Levels of a certain substance (e.g. Pb) in a composite sample
25 Figure 2 – Cross-section of a 900 µm wide lead oxide-based resistor (SMD)
26 5.7.6 Determination of sampling of homogeneous materials from different positions
6 Conclusions and recommendations for sampling
7 Mechanical sample preparation
7.1 Overview
7.1.1 Field of application
27 7.1.2 Quality assurance
7.2 Apparatus, equipment and materials
28 7.3 Procedure
7.3.1 General
7.3.2 Manual cutting
7.3.3 Coarse grinding or milling
7.3.4 Homogenizing
7.3.5 Fine grinding or milling
29 7.3.6 Very fine grinding of polymers and organic materials
30 Annex A (informative)Examples of procedures for sampling and disjointment
31 Figure A.1 – Methodology for sampling and disjointment
32 Figure A.2 – Sampling of DVD player
33 Figure A.3 – Sampling of LCD TV
34 Figure A.4 – Sampling of PDA
35 Figure A.5 – Sampling of desk fan
36 Figure A.6 – Sampling of parts – Thick film resistor
37 Figure A.7 – Sampling of parts – SMD potentiometer
38 Annex B (informative)Probability of the presence of certain substances
Table B.1 – Probability of the presence of certain substances in materialsand parts used in electrotechnical products
41 Table B.2 – Probability of the presence of additionalcertain substances in polymeric materials
42 Annex C (informative)Composite testing and sampling
C.1 Introductory remarks
C.2 Calculated maximum concentration for a composite sample based on detection limit
43 C.3 Required detection limit for a composite sample based on the maximum allowable concentration
Table C.1 – Calculated maximum concentration for a composite samplebased on detection limit
44 Table C.2 – Required detection limit for a composite sample based onthe maximum allowable concentration
45 Annex D (informative)Tools used in sampling
Figure D.1 – Hot gas gun for removing electronic parts
Figure D.2 – Vacuum pin to remove target electronic devices
46 Annex E (informative)Examples of mobile phone disassembly and disjointment
E.1 General
E.2 Partial disassembly without tools – Mobile phone type A
Figure E.1 – Mobile phone type A with battery charger and camera lens cap
47 Figure E.2 – Mobile phone type A with battery and back cover removed
Table E.1 – Possible certain substances or screening substancesfrom a mobile phone (type A)
48 E.3 Partial disassembly with simple tools – Mobile phone type B
Figure E.3 – Partial disassembly of a mobile phone (type B) into its major parts
Table E.2 – Possible certain substances in major parts of the mobile phone (type B)
49 E.4 Complete disassembly – Mobile phone type B
Figure E.4 – Complete disassembly of key pad
Figure E.5 – Complete disassembly of bottom housing
50 E.5 Partial disjointment – Mobile phone type B
Figure E.6 – Complete disassembly of other housing or frame
Figure E.7 – Parts of the TFT display of the mobilephone (type B) after partial disjointment
51 E.6 Complete disjointment – Examples of disjointment of small electronic parts
Figure E.8 – Parts of the main PCB of the mobilephone (type B) after partial disjointment
52 Table E.3 – Examples of disjointment for typical small electronic parts
53 E.7 Complete disjointment of integrated circuit lead frame package
E.8 Complete disjointment of ball grid array (BGA) package
E.8.1 General
Figure E.9 – Disjointment of lead frame
54 E.8.2 Solder ball removal from BGA package – Hand removal procedure
Figure E.10 – BGA package prior to disjointment
Figure E.11 – BGA package disjointed by hand removal procedure
55 E.8.3 Solder ball removal from BGA package – Solder ball shear procedure
Figure E.12 – Solder ball material collected from BGA using hand removal procedure
Figure E.13 – BGA solder ball removal using ball shear procedure
56 Bibliography

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