BS IEC 62899-202-7:2021

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Printed electronics – Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method

Published By	Publication Date	Number of Pages
BSI	2021	16

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Categories: 29.035.01 - Insulating materials in general, BSI

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This part of IEC 62899 provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.

PDF Catalog

PDF Pages	PDF Title
2	undefined
4	CONTENTS
5	FOREWORD
7	INTRODUCTION
8	1 Scope 2 Normative references 3 Terms and definitions
9	4 Standard atmospheric conditions 5 Test sample 5.1 General 5.2 Size of test sample 5.3 Applicability of the method
10	6 Testing method and test apparatus 6.1 General 6.2 Test apparatus Figure 1 – Schematic of peel test of the printed layer on a flexible substrate
11	6.3 Test procedure Figure 2 – Apparatus for peel test of the printed layer on a flexible substrate
12	7 Data analysis 7.1 Peel strength calculation 7.2 Report of the results Figure 3 – Typical peeling curve measured during the peel test
14	Bibliography