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BSI DD IEC/PAS 62647-23:2011

BSI DD IEC/PAS 62647-23:2011

$189.07

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

Published By Publication Date Number of Pages
BSI 2011 47
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IEC/PAS 62647-23:2011(E) provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes.

PDF Catalog

PDF Pages PDF Title
4 CONTENTS
6 FOREWORD
8 INTRODUCTION
10 1 Scope
2 Normative references
11 3 Terms and definitions
16 4 Symbols and abbreviated terms
17 5 Pb-Free Concerns
5.1 Reliability
18 5.2 Configuration management
19 5.3 Risk management
5.4 Tin whiskers
5.5 Copper dissolution (erosion)
6 Materials
6.1 Solder
20 6.2 Fluxes
21 6.3 Piece parts
6.4 Printed circuit boards
22 6.5 Conformal coatings
7 Soldering equipment
23 7.1 Hand soldering equipment
24 7.2 Fountain soldering
Figure 1 – Soldering iron tip construction
Figure 2 – Worn soldering iron tip
25 Figure 3 – Copper dissolution
26 7.3 Convective soldering equipment
8 General rework/repair considerations
27 8.1 Rework/repair procedure order of precedence
8.2 Technician training
8.3 Pb-Free rework/repair considerations
29 9 Pre-rework/repair processes
9.1 Alloy identification
30 Table 1 – Assembly and piece part marking methods
31 9.2 Piece part and CCA preparation
32 10 Rework/repair processes
10.1 Conductive Hand Soldering
34 10.2 Convective soldering process
36 11 Post-Rework/Repair Processes
11.1 Cleaning
11.2 Inspection
11.3 Reapplication of Conformal Coating
37 Annex A (informative) Termination Finishes
Table A.1 – Piece-part terminal and BGA ball metallization solder process compatibility risk (see IEC/PAS 62647-22 (GEIA-HB-0005-2))
38 Table A.2 – BGA Piece parts
39 Annex B (informative) Tin whiskers
40 Table B.1 – Tin whisker information (see IEC/PAS 62647-22 (GEIA-HB-0005-2))
42 Table B.2 – Piece part termination tin whisker risk(see IEC/PAS 62647-22 (GEIA-HB-0005-2))
44 Bibliography

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BSI DD IEC/PAS 62647-23:2011
$189.07