DIN EN ISO 9453:2021 Edition
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Soft solder alloys – Chemical compositions and forms
Published By | Publication Date | Number of Pages |
DIN | 2021-01 | 22 |
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This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.
Published Code | DIN |
---|---|
Published By | Deutsches Institut für Normung |
Publication Date | 2021-01 |
Pages Count | 22 |
Language | Germany |
Descriptors | Alloys, Chemical composition, Definitions, Fillers, Form of delivery, Marking, Packages, Sampling methods, Shape, Soft solders, Solders, Sounding heads, Specifications, Tin-containing alloys, Welding engineering |
File Size | 1.4 MB |
ICS Codes | 25.160.50 - Brazing and soldering |
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