TIA TSB-144:2003 (R2012)
$26.00
Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and Challenges
| Published By | Publication Date | Number of Pages |
| TIA | 2003 | 24 |
The bulletin is applicable to fiber optic component reliability.
The document is written for fiber optic component manufacturers, as
well as end-users, and was prepared by TIA Working Group FO-6.3.1,
Adhesives Reliability under the cognizance of FO-6.3 SC
Subcommittee on Interconnecting Devices and Passive Products.
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