{"id":239084,"date":"2024-10-19T15:37:58","date_gmt":"2024-10-19T15:37:58","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-iec-ts-62647-22012\/"},"modified":"2024-10-25T10:19:47","modified_gmt":"2024-10-25T10:19:47","slug":"bsi-pd-iec-ts-62647-22012","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-iec-ts-62647-22012\/","title":{"rendered":"BSI PD IEC\/TS 62647-2:2012"},"content":{"rendered":"

This Technical Specification establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems.<\/p>\n

This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes.<\/p>\n

This document may be used by other high-performance and high-reliability industries, at their discretion.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
4<\/td>\nCONTENTS <\/td>\n<\/tr>\n
6<\/td>\nFOREWORD <\/td>\n<\/tr>\n
8<\/td>\nINTRODUCTION <\/td>\n<\/tr>\n
9<\/td>\n1 Scope
2 Normative references <\/td>\n<\/tr>\n
10<\/td>\n3 Terms, definitions and abbreviations
3.1 Terms and definitions <\/td>\n<\/tr>\n
13<\/td>\n3.2 Abbreviations <\/td>\n<\/tr>\n
14<\/td>\n4 Technical requirement
4.1 Control level requirements
4.1.1 General <\/td>\n<\/tr>\n
16<\/td>\n4.1.2 Control levels and levels of integration
4.1.3 COTS and level selection
4.1.4 Other level selection information <\/td>\n<\/tr>\n
17<\/td>\n4.2 Requirements for control levels
4.2.1 Control level 1 requirements
4.2.2 Control level 2A requirements <\/td>\n<\/tr>\n
18<\/td>\n4.2.3 Control level 2B requirements <\/td>\n<\/tr>\n
19<\/td>\n4.2.4 Control level 2C requirements <\/td>\n<\/tr>\n
21<\/td>\n4.2.5 Control level 3 requirements
4.2.6 Requirements for mitigating tin whisker risk for solder joints <\/td>\n<\/tr>\n
22<\/td>\n4.3 Implementation methods
4.3.1 Flowing requirements to lower level suppliers (applies to control level 2B, control level 2C, and control level 3)
4.3.2 Detecting and controlling Pb-free tin finish introduction
4.3.3 Sample monitoring plans (applies to control level 2B and control level 2C)
4.3.4 Lot monitoring requirements (applies to control level 3) <\/td>\n<\/tr>\n
23<\/td>\n4.4 Methods for mitigating impact of Pb-free tin (applies to control level 2B, control level 2C)
4.4.1 General
4.4.2 Hard potting and encapsulation
4.4.3 Physical barriers
4.4.4 Conformal and other coats <\/td>\n<\/tr>\n
24<\/td>\n4.4.5 SnPb soldering process with validated coverage
4.4.6 Circuit and design analysis <\/td>\n<\/tr>\n
25<\/td>\n4.5 Part selection process
4.6 Assessment and documentation of risk and mitigation effectiveness
4.6.1 General <\/td>\n<\/tr>\n
26<\/td>\n4.6.2 Elements of assessment
4.6.3 Other risk analysis issues <\/td>\n<\/tr>\n
27<\/td>\nAnnex A (informative) Guidance on control levels, risk assessment, and mitigation evaluation <\/td>\n<\/tr>\n
28<\/td>\nFigures
Figure A.1 \u2013 Decision tree <\/td>\n<\/tr>\n
29<\/td>\nFigure A.2 \u2013 Decision tree, sub-tree 1 <\/td>\n<\/tr>\n
30<\/td>\nFigure A.3 \u2013 Decision tree, sub-tree 2 <\/td>\n<\/tr>\n
33<\/td>\nTables
Table A.1 \u2013 Control level summary table (1 of 2) <\/td>\n<\/tr>\n
35<\/td>\nAnnex B (informative) Technical guide on detection methods, mitigation methods, and methods for limiting impact of tin <\/td>\n<\/tr>\n
36<\/td>\nTable B.1 \u2013 Conformal coating material physical properties from S. Meschter [10] <\/td>\n<\/tr>\n
37<\/td>\nTable B.2 \u2013 Conformal coating physical properties from T. Woodrow [12] <\/td>\n<\/tr>\n
38<\/td>\nTable B.3 \u2013 Conformal coating physical properties from R. Kumar [13] <\/td>\n<\/tr>\n
41<\/td>\nFigure B.1 \u2013 Insufficient solder flow <\/td>\n<\/tr>\n
47<\/td>\nAnnex C (informative) Tin whisker inspection <\/td>\n<\/tr>\n
48<\/td>\nFigure C.1 \u2013 Equipment setup for whisker examination <\/td>\n<\/tr>\n
49<\/td>\nFigure C.2 \u2013 Whiskers examination areas and direction
Figure C.3 \u2013 Side-illumination by flexible light
Figure C.4 \u2013 Coating residuals and dusts attached on lead-frame with conformal coating <\/td>\n<\/tr>\n
50<\/td>\nFigure C.5 \u2013 Comparisons between whisker observations by microscope and SEM
Figure C.6 \u2013 Limitation of microscope observation <\/td>\n<\/tr>\n
53<\/td>\nFigure C.7 \u2013 Preliminary whisker examination in non-coated test specimens <\/td>\n<\/tr>\n
54<\/td>\nAnnex D (informative) Analysis and risk assessment guidance <\/td>\n<\/tr>\n
58<\/td>\nAnnex E (informative) Whiskers growing from solder joint fillets and bulk solder
Figure E.1 \u2013 Whiskers and hillocks formed after 500 hours of storage at 85\u00a0\u00b0C \/ 85\u00a0%\u00a0RH followed by \u201355\u00a0\u00b0C to 85\u00a0\u00b0C air to air cycling, 1\u00a0000 cycles <\/td>\n<\/tr>\n
59<\/td>\nFigure E.2 \u2013 Long whisker growing from SAC405 no-clean assembly reported by Terry Munson (Foresite) <\/td>\n<\/tr>\n
60<\/td>\nFigure E.3 \u2013 Whiskers and hillocks protruding through flux residueand growing from solder free of the flux residue [87] <\/td>\n<\/tr>\n
61<\/td>\nFigure E.4 \u2013 Tin whisker length impact by ionic cleanliness
Figure E.5 \u2013 Tin whisker density impact by ionic cleanliness <\/td>\n<\/tr>\n
62<\/td>\nFigure E.6 \u2013 Whisker length depending on component and assembly cleanliness <\/td>\n<\/tr>\n
63<\/td>\nFigure E.7 \u2013 Microstructures of solder fillet with 0,8\u00a0%\u00a0HBr activated flux assembled in air after 1\u00a0000 hours at 85\u00a0\u00b0C \/ 85\u00a0%\u00a0RH
Figure E.8 \u2013 The mechanism of Sn whisker formation on solder fillet induced by oxidation <\/td>\n<\/tr>\n
64<\/td>\nFigure E.9 \u2013 SAC105 bulk solder at ambient T in nitrogen chamber [34] <\/td>\n<\/tr>\n
65<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Mitigation of deleterious effects of tin<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2013<\/td>\n72<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":239090,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[89,2641],"product_tag":[],"class_list":{"0":"post-239084","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-03-100-50","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/239084","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/239090"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=239084"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=239084"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=239084"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}