{"id":401107,"date":"2024-10-20T04:54:24","date_gmt":"2024-10-20T04:54:24","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/ieee-p1573\/"},"modified":"2024-10-26T08:41:44","modified_gmt":"2024-10-26T08:41:44","slug":"ieee-p1573","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/ieee\/ieee-p1573\/","title":{"rendered":"IEEE P1573"},"content":{"rendered":"
Revision Standard – Active – Draft. This recommended practice provides a technical basis for implementation of electronic power subsystems. It is intended for electronic systems engineers and integrators, electronic power subsystem designers and integrators, as well as power element manufacturers and suppliers. It addresses system- level issues in element or subsystem integration, adaptation, and accommodation. It also defines system interface parameters, test methods, and test conditions. This recommended practice applies to ac\u2013dc, dc-ac and dc\u2013dc electronic power subsystems. The range of electronic power subsystems includes those with dc, single-phase, and three-phase inputs, having power levels from a fraction of a watt up to 20 kW. The voltage range is 600 V and below at a frequency or frequencies of dc 1 kHz. Internal operating frequencies within elements or subsystems may be much higher than 1 kHz. This recommended practice may be used outside the range where applicable. This recommended practice builds on and supplements IEEE Std 1515-2000.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
1<\/td>\n | IEEE Std 1573\u2122-2021 Front cover <\/td>\n<\/tr>\n | ||||||
2<\/td>\n | Title page <\/td>\n<\/tr>\n | ||||||
4<\/td>\n | Important Notices and Disclaimers Concerning IEEE Standards Documents <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | Participants <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | Introduction <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | Contents <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | List of Figures <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | List of Tables <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 1.\u2002Overview 1.1\u2002Scope 1.2\u2002Purpose 1.3\u2002Word usage <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | 1.4\u2002Organization <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 2.\u2002Normative references 3.\u2002Definitions, acronyms, and abbreviations 3.1\u2002Definitions <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 3.2\u2002Acronyms and abbreviations <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | 4.\u2002Element-level parameters 4.1\u2002Set point voltage accuracy 4.2\u2002Maximum power dissipation 4.3\u2002Contact resistance 4.4\u2002Input undervoltage protection <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | 4.5\u2002Input overvoltage protection <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | 4.6\u2002Overtemperature shutdown <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | 4.7\u2002Reverse voltage protection <\/td>\n<\/tr>\n | ||||||
27<\/td>\n | 4.8\u2002Turn-on time 4.9\u2002Regulation, combined 4.10\u2002Regulation effects due to aging <\/td>\n<\/tr>\n | ||||||
28<\/td>\n | 4.11\u2002Lightning 4.12\u2002Surge 4.13\u2002Sag 5.\u2002Electronic power subsystems <\/td>\n<\/tr>\n | ||||||
29<\/td>\n | 5.1\u2002Interface definition <\/td>\n<\/tr>\n | ||||||
32<\/td>\n | 5.2\u2002Requirements definition 5.3\u2002Architectural considerations <\/td>\n<\/tr>\n | ||||||
39<\/td>\n | 5.4\u2002System interaction <\/td>\n<\/tr>\n | ||||||
40<\/td>\n | 6.\u2002Electrical interface parameters 6.1\u2002Status monitoring 6.2\u2002Supervisory control 6.3\u2002Built-in-test <\/td>\n<\/tr>\n | ||||||
41<\/td>\n | 6.4\u2002Electromagnetic compatibility\/electromagnetic interference <\/td>\n<\/tr>\n | ||||||
44<\/td>\n | 7.\u2002Mechanical interface parameters 7.1\u2002Packaging <\/td>\n<\/tr>\n | ||||||
46<\/td>\n | 7.2\u2002Center of gravity <\/td>\n<\/tr>\n | ||||||
47<\/td>\n | 7.3\u2002Cooling or thermal energy dissipation process <\/td>\n<\/tr>\n | ||||||
48<\/td>\n | 8.\u2002Environmental interface parameters <\/td>\n<\/tr>\n | ||||||
49<\/td>\n | 8.1\u2002Thermal 8.2\u2002Resistance to contaminants 8.3\u2002Sand and dust <\/td>\n<\/tr>\n | ||||||
50<\/td>\n | 8.4\u2002Explosive atmosphere 8.5\u2002Acoustics <\/td>\n<\/tr>\n | ||||||
51<\/td>\n | 8.6\u2002Radiation <\/td>\n<\/tr>\n | ||||||
53<\/td>\n | 9.\u2002System effectiveness interface parameters 9.1\u2002Qualification requirements <\/td>\n<\/tr>\n | ||||||
54<\/td>\n | 9.2\u2002Quality assurance 9.3\u2002Acceptance testing <\/td>\n<\/tr>\n | ||||||
55<\/td>\n | 9.4\u2002Compliance information 9.5\u2002Logistics <\/td>\n<\/tr>\n | ||||||
56<\/td>\n | 9.6\u2002Configuration management 9.7\u2002Obsolescence 9.8\u2002Discontinuance 9.9\u2002Production line certification 9.10\u2002Warranty 10.\u2002System integration <\/td>\n<\/tr>\n | ||||||
57<\/td>\n | 10.1\u2002System interaction <\/td>\n<\/tr>\n | ||||||
61<\/td>\n | 10.2\u2002Protection and sensing <\/td>\n<\/tr>\n | ||||||
63<\/td>\n | 10.3\u2002Output sequencing and clamping <\/td>\n<\/tr>\n | ||||||
64<\/td>\n | 10.4\u2002Supervisory\/status monitoring, control, and software implementation <\/td>\n<\/tr>\n | ||||||
66<\/td>\n | 10.5\u2002System reliability <\/td>\n<\/tr>\n | ||||||
69<\/td>\n | 10.6\u2002Logistics <\/td>\n<\/tr>\n | ||||||
70<\/td>\n | 11.\u2002System adaptation 11.1\u2002Electrical interface adaptations <\/td>\n<\/tr>\n | ||||||
88<\/td>\n | 11.2\u2002Mechanical interface adaptation <\/td>\n<\/tr>\n | ||||||
90<\/td>\n | 11.3\u2002Environmental interface adaptation <\/td>\n<\/tr>\n | ||||||
97<\/td>\n | 11.4\u2002System effectiveness interface adaptation <\/td>\n<\/tr>\n | ||||||
103<\/td>\n | 11.5\u2002Adaptation analysis techniques <\/td>\n<\/tr>\n | ||||||
104<\/td>\n | Annex\u00a0A (informative) Bibliography <\/td>\n<\/tr>\n | ||||||
107<\/td>\n | Annex\u00a0B (informative) Performance <\/td>\n<\/tr>\n | ||||||
110<\/td>\n | B.1\u2002Electrical interface performance B.2\u2002Mechanical interface performance <\/td>\n<\/tr>\n | ||||||
111<\/td>\n | B.3\u2002Environmental interface performance <\/td>\n<\/tr>\n | ||||||
112<\/td>\n | B.4\u2002System effectiveness performance <\/td>\n<\/tr>\n | ||||||
115<\/td>\n | Annex\u00a0C (informative) Parameter index <\/td>\n<\/tr>\n | ||||||
120<\/td>\n | Annex\u00a0D (informative) Radiation environments D.1\u2002Radiation environmental\/definition D.2\u2002Definition of terms <\/td>\n<\/tr>\n | ||||||
123<\/td>\n | D.3\u2002Radiation environments <\/td>\n<\/tr>\n | ||||||
127<\/td>\n | D.4\u2002Radiation design considerations <\/td>\n<\/tr>\n | ||||||
130<\/td>\n | D.5\u2002Radiation testing <\/td>\n<\/tr>\n | ||||||
132<\/td>\n | Back cover <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" IEEE Approved Draft Recommended Practice for Electronic Power Subsystems: Parameters, Interfaces, Elements, and Performance<\/b><\/p>\n |