{"id":423262,"date":"2024-10-20T06:45:31","date_gmt":"2024-10-20T06:45:31","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-62435-92021-2\/"},"modified":"2024-10-26T12:40:37","modified_gmt":"2024-10-26T12:40:37","slug":"bs-en-iec-62435-92021-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-62435-92021-2\/","title":{"rendered":"BS EN IEC 62435-9:2021"},"content":{"rendered":"

This part of IEC 62435 specifies storage practices encompassing silicon and semiconductor device building blocks of all types that are integrated together to into products in the form of either packages or boards that can be stored as fully assembled units or partial assemblies. Special attention is given to memories as components and assemblies although methods also apply to heterogeneous components. Guidelines and requirements for customer-supplier interaction are provided to manage the complexity.<\/p>\n

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NOTE In IEC 62435 (all parts), the term “components” is used interchangeably with dice, wafers, passives and packaged devices.<\/p>\n<\/blockquote>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
5<\/td>\nAnnex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n
7<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
8<\/td>\nFOREWORD <\/td>\n<\/tr>\n
10<\/td>\nINTRODUCTION <\/td>\n<\/tr>\n
12<\/td>\n1 Scope
2 Normative references
3 Terms and definitions <\/td>\n<\/tr>\n
14<\/td>\n4 Component storage cases
5 Storage of memory devices
5.1 General
5.2 Semiconductor memory device types <\/td>\n<\/tr>\n
15<\/td>\nTable 1 \u2013 Example failure mechanisms and stimuli for memory devices <\/td>\n<\/tr>\n
16<\/td>\n6 Storage of other devices and partial assembly
6.1 General
6.2 Wafer-level chip-scale packages <\/td>\n<\/tr>\n
17<\/td>\n6.3 Heterogeneous devices
6.4 Modules
7 Storage in alternative environments
7.1 General
7.2 Alternative environments <\/td>\n<\/tr>\n
18<\/td>\n7.3 Storage environment effect on use reliability <\/td>\n<\/tr>\n
19<\/td>\nAnnex A (informative)Customer-supplier interaction
Table A.1 \u2013 Supplier \u2013 customer interaction template <\/td>\n<\/tr>\n
20<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Electronic components. Long-term storage of electronic semiconductor devices – Special cases<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2021<\/td>\n22<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":423266,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-423262","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/423262","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/423266"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=423262"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=423262"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=423262"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}