IEC TR 60068-3-12:2007
$33.15
Environmental testing – Part 3-12: Supporting documentation and guidance – Method to evaluate a possible lead-free solder reflow temperature profile
| Published By | Publication Date | Number of Pages |
| IEC | 2007-03-12 | 20 |
Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)
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