{"id":238983,"date":"2024-10-19T15:37:26","date_gmt":"2024-10-19T15:37:26","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-dd-iec-pas-62647-232011\/"},"modified":"2024-10-25T10:19:03","modified_gmt":"2024-10-25T10:19:03","slug":"bsi-dd-iec-pas-62647-232011","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-dd-iec-pas-62647-232011\/","title":{"rendered":"BSI DD IEC\/PAS 62647-23:2011"},"content":{"rendered":"
IEC\/PAS 62647-23:2011(E) provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking\/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked\/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
4<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
6<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | 4 Symbols and abbreviated terms <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 5 Pb-Free Concerns 5.1 Reliability <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 5.2 Configuration management <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 5.3 Risk management 5.4 Tin whiskers 5.5 Copper dissolution (erosion) 6 Materials 6.1 Solder <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 6.2 Fluxes <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | 6.3 Piece parts 6.4 Printed circuit boards <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | 6.5 Conformal coatings 7 Soldering equipment <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | 7.1 Hand soldering equipment <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | 7.2 Fountain soldering Figure 1 \u2013 Soldering iron tip construction Figure 2 \u2013 Worn soldering iron tip <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | Figure 3 \u2013 Copper dissolution <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | 7.3 Convective soldering equipment 8 General rework\/repair considerations <\/td>\n<\/tr>\n | ||||||
27<\/td>\n | 8.1 Rework\/repair procedure order of precedence 8.2 Technician training 8.3 Pb-Free rework\/repair considerations <\/td>\n<\/tr>\n | ||||||
29<\/td>\n | 9 Pre-rework\/repair processes 9.1 Alloy identification <\/td>\n<\/tr>\n | ||||||
30<\/td>\n | Table 1 \u2013 Assembly and piece part marking methods <\/td>\n<\/tr>\n | ||||||
31<\/td>\n | 9.2 Piece part and CCA preparation <\/td>\n<\/tr>\n | ||||||
32<\/td>\n | 10 Rework\/repair processes 10.1 Conductive Hand Soldering <\/td>\n<\/tr>\n | ||||||
34<\/td>\n | 10.2 Convective soldering process <\/td>\n<\/tr>\n | ||||||
36<\/td>\n | 11 Post-Rework\/Repair Processes 11.1 Cleaning 11.2 Inspection 11.3 Reapplication of Conformal Coating <\/td>\n<\/tr>\n | ||||||
37<\/td>\n | Annex A (informative) Termination Finishes Table A.1 \u2013 Piece-part terminal and BGA ball metallization solder process compatibility risk (see IEC\/PAS 62647-22 (GEIA-HB-0005-2)) <\/td>\n<\/tr>\n | ||||||
38<\/td>\n | Table A.2 \u2013 BGA Piece parts <\/td>\n<\/tr>\n | ||||||
39<\/td>\n | Annex B (informative) Tin whiskers <\/td>\n<\/tr>\n | ||||||
40<\/td>\n | Table B.1 \u2013 Tin whisker information (see IEC\/PAS 62647-22 (GEIA-HB-0005-2)) <\/td>\n<\/tr>\n | ||||||
42<\/td>\n | Table B.2 \u2013 Piece part termination tin whisker risk(see IEC\/PAS 62647-22 (GEIA-HB-0005-2)) <\/td>\n<\/tr>\n | ||||||
44<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies<\/b><\/p>\n |