{"id":389930,"date":"2024-10-20T03:52:16","date_gmt":"2024-10-20T03:52:16","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-iec-tr-63378-12021\/"},"modified":"2024-10-26T07:07:05","modified_gmt":"2024-10-26T07:07:05","slug":"bsi-pd-iec-tr-63378-12021","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-iec-tr-63378-12021\/","title":{"rendered":"BSI PD IEC TR 63378-1:2021"},"content":{"rendered":"
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
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2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
4<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions 3.1 Terms and letter symbols related to temperature (unit [\u00b0C or K]) <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 3.2 Terms and letter symbols related to thermal characteristics Figures Figure 1 \u2013 Definition of temperature <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | Figure 2 \u2013 Definition of thermal resistance <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | Figure 3 \u2013 Thermal resistance <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | Figure 4 \u2013 Thermal resistance and thermal characterization parameter <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 4 Accuracy of \u03b8JA 4.1 Variation of \u03b8JA 4.1.1 General 4.1.2 Analysis model Figure 5 \u2013 Thermal characterization parameter <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 4.1.3 Simulation conditions (typical values) 4.1.4 Evaluation items and standards Figure 6 \u2013 Simulation conditions Table 1 \u2013 Evaluation items and evaluation parameters <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 4.1.5 Evaluation results Figure 7 \u2013 \u03b8JA dependence on board remaining copper rate (BGA) <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | Figure 8 \u2013 \u03b8JA dependence on remaining copper rate (LQFP) <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Figure 9 \u2013 \u03b8JA dependence on ambient air temperature TA (BGA) <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | Figure 10 \u2013 \u03b8JA dependence on ambient air temperature TA (LQFP) <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | Figure 11 \u2013 \u03b8JA dependence on power dissipation (BGA) <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 4.1.6 Summary Figure 12 \u2013 \u03b8JA dependence on power dissipation (LQFP) Figure 13 \u2013 Influence items and their impact on \u03b8JA <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 4.2 Discrepancy of \u03b8JA <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | 5 Guideline for thermal design Figure 14 \u2013 The gap of \u03b8JA by the difference of the environment <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Thermal standardization on semiconductor packages – Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages<\/b><\/p>\n |